Semiconductor light emitting device and wafer
AssigneeKabushiki Kaisha Toshiba
InventorsKei KANEKO, Yasuo OHBA, Hiroshi KATSUNO, Mitsuhiro Kushibe
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AssigneeKabushiki Kaisha Toshiba
InventorsKei KANEKO, Yasuo OHBA, Hiroshi KATSUNO, Mitsuhiro Kushibe
Estimating the term…
A semiconductor light emitting device includes a first layer made of at least one of n-type GaN and n-type AlGaN; a second layer made of Mg-containing p-type AlGaN; and a light emitting section provided between the first layer and the second layer. The light emitting section included a plurality of barrier layers made of Si-containing AlxGa1−x−yInyN (0≦x, 0≦y, x+y≦1), and a well layer provided between each pair of the plurality of barrier layers and made of GaInN or AlGaInN. The plurality of barrier layers have a nearest barrier layer and a far barrier layer. The nearest barrier layer is nearest to the second layer among the plurality of barrier layers. The nearest barrier layer includes a first portion and a second portion. The first portion is made of Si-containing AlxGa1−x−yInyN (0≦x, 0≦y, x+y≦1). The second portion is provided between the first portion and the second layer and is made of AlxGa1−x−yInyN (0≦x, 0≦y, x+y≦1). The Si concentration in the second portion is lower than a Si concentration in the first portion and lower than a Si concentration in the far barrier layer.
A semiconductor light emitting device comprising:
A semiconductor light emitting device comprising:
A wafer comprising:
A wafer comprising:
Dependencies are inferred from the claim text.