Tin alloy solder composition
AssigneeAmerican Iron & Metal Company, Inc.
InventorKarl F. Seelig
Life of this patent
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Abstract
A lead-free and solder alloy composition for electronic assembly applications having reduced toxicity. The alloy composition comprises, by weight, about 0.2% to about 1% copper; about 0.001% to about 0.039% nickel; about 0.001% to about 0.039% cobalt; and the balance of tin. The alloy composition has a melting temperature of about 227° C., with superior wetting and mechanical strength making the alloy composition wells suited for electronic circuit board manufacture and lead less component bumping or column arrays, and replacement of conventional tin-lead solders.
Claims32
A lead-free solder alloy composition comprising by weight about 0.2% to about 1% copper;
- about 0.001% to about 0.039% nickel;
- about 0.001% to about 0.039% cobalt;
- and the balance of tin, the composition being substantially free from antimony.
(canceled)
A lead-free solder alloy composition comprising by weight about 0.5% to about 0.7% copper;
- about 0.02% to about 0.03% nickel;
- about 0.02% to about 0.03% cobalt;
- and the balance of tin, the alloy composition being substantially free from antimony.
A lead-free solder alloy composition comprising by weight about 0.5% to about 0.7% copper;
- about 0.02% to about 0.03% nickel;
- about 0.02% to about 0.03% cobalt;
- about 0.01% to about 0.5% silver;
- and the balance of tin, the alloy composition being substantially free from antimony.
A lead less component bumping or column array comprising a lead-free solder alloy composition, the lead-free solder alloy composition comprising by weight about 0.2% to about 1% copper;
- about 0.001% to about 0.039% nickel;
- about 0.001% to about 0.039% cobalt;
- and the balance of tin, the alloy composition being substantially free from antimony.
An electronic assembly comprising a lead-free solder alloy composition, the lead-free solder alloy composition comprising by weight about 0.2% to about 1% copper;
- about 0.001% to about 0.039% nickel;
- about 0.001% to about 0.039% cobalt;
- and the balance of tin, the alloy composition being substantially free from antimony.
A method of forming a solder connection comprising:
- applying a lead-free solder alloy composition, the lead-free solder alloy composition comprising by weight about 0.2% to about 1% copper;
- about 0.001% to about 0.039% nickel;
- about 0.001% to about 0.039% cobalt;
- and the balance of tin, the alloy composition being substantially free from antimony.
Dependencies are inferred from the claim text.