Honeycomb structure package
AssigneeNGK Insulators, Ltd.
InventorsKoji SHIRAKI, Toru HOSOI
Life of this patent
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Abstract
There is disclosed a package which does not have a very large package height even when containing products, whereby the deterioration of a transport efficiency can be prevented, and which can realize stacking in a large number of stages while avoiding the damage of honeycomb structures. The honeycomb structure package includes a plate base, a receiving member which is disposed on the base to support the side surface portions of honeycomb structures, and a rectangular parallelepiped box member constituted of five rigid panels which surround the lower surfaces and side surfaces of the base and the receiving member.
Claims12
A honeycomb structure package including:
- a plate base;
- a receiving member which is disposed on the base to support the side surface portions of honeycomb structures;
- and
- a rectangular parallelepiped box member constituted of five rigid panels which surround the lower surfaces and side surfaces of the base and the receiving member.
Dependencies are inferred from the claim text.