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US 2010/0059257 A1Published application
Method of nickel-gold plating and printed circuit board
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsJin-Hak CHOI, Seoung-Jae Lee, Bae-Kyun Kim, Eun-Ju Yang, Jong-Yun Kim, Yeo-Joo Yoon
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Abstract
Disclosed are a method of electroless nickel-gold plating an object and a printed circuit board. The method in accordance with an embodiment of the present invention includes: forming a first nickel plated layer on a surface of the object; forming a second nickel plated layer on the first nickel plated layer; and forming a gold plated layer on the second nickel plated layer.
Claims10
A method of electroless nickel-gold plating an object, the method comprising:
- forming a first nickel plated layer on a surface of the object;
- forming a second nickel plated layer on the first nickel plated layer;
- and
- forming a gold plated layer on the second nickel plated layer.
1 more element
A printed circuit board comprising:
- a substrate;
- a circuit pattern formed on a surface of the substrate;
- a first nickel plated layer formed on the circuit pattern;
- a second nickel plated layer formed on the first nickel plated layer;
- and
- a gold plated layer formed on the second nickel plated layer.
3 more elements
Dependencies are inferred from the claim text.