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US 2010/0059183 A1Published application
Wafer taping and detaping machine
AssigneeHiwin Mikrosystem Corp.
InventorsGao-Heng Lin, Pzung-Cheng Liou
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Abstract
A wafer taping and detaping machine implements a taping roller set and a detaping roller set to conduct an automatic taping and detaping process on a surface of a wafer that is positioned on a wafer mount so as to remove processing particles from the surface of the wafer.
Claims14
A wafer taping and detaping machine, comprising:
- a wafer mount, holding a wafer at a taping and detaping position;
- a taping roller set and a detaping roller set, arranged above the wafer mount and linearly reciprocating;
- a tape feeder, delivering and retrieving a tape of a tape roll, wherein the delivered tape is led to pass the taping roller set and the detaping roller set;
- a wafer pressure sensing module, provided in the wafer mount for sensing a pressure that the taping roller set applies to the wafer and converting the sensed pressure into an electric signal;
- a position adjusting mechanism, connected to the wafer mount for receiving the electric signal from the wafer pressure sensing module and vertically adjusting a position of the wafer mount according to the electric signal;
- and
- a taping pressure sensing module, provided in the taping roller set for sensing a pressure that the tape applies to the taping roller set and converting the sensed pressure into an electric signal, wherein the tape feeder receives the electric signal and adjusts a tension of the delivered tape.
4 more elements
Dependencies are inferred from the claim text.