Method of manufacturing semiconductor device and cleaning apparatus
AssigneeKabushiki Kaisha Toshiba
InventorsTsuyoshi Matsumura, Yoshihiro Uozumi, Kunihiro Miyazaki
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Abstract
The disclosure concerns a manufacturing method of a semiconductor device includes dry-etching a semiconductor substrate or a structure formed on the semiconductor substrate; supplying a solution onto the semiconductor substrate; measuring a specific resistance or a conductivity of the supplied solution; and supplying a removal solution for removing the etching residual material onto the semiconductor substrate for a predetermined period of time based on the specific resistance or the conductivity of the solution, when an etching residual material adhering to the semiconductor substrate or the structure is removed.
Claims6
-11. (canceled)
A cleaning apparatus comprising:
- a stage rotating a semiconductor substrate to which an etching residual material adheres, the stage controlling a temperature of the semiconductor substrate;
- a first nozzle which discharges a solution onto a surface of the semiconductor substrate;
- a measuring unit which measures a specific resistance or a conductivity of the solution discharged onto the semiconductor substrate;
- a processing unit which determines time for supplying the removal solution onto the semiconductor substrate on the basis of the specific resistance or the conductivity of the solution;
- and
- a second nozzle which discharges a removal solution for removing the etching residual material depending on the time determined by the processing unit.
Dependencies are inferred from the claim text.