Curable silicone resin composition, cured product thereof, and opaque silicone adhesive sheet formed from the composition
OwnerTsutomu KASHIWAGIinventor
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OwnerTsutomu KASHIWAGIinventor
Estimating the term…
Disclosed is a curable silicone resin composition that is solid at room temperature, the composition including: (A) an organopolysiloxane having a resin structure consisting of specific siloxane units, (B) an organohydrogenpolysiloxane having a resin structure consisting of specific siloxane units, (C) a platinum group metal-based catalyst, (D) either one or both of an opaque pigment and an opaque dye, and (E) a reaction retarder, in which a layer of thickness 100 μm formed from a cured product of the composition exhibits a light transmittance of not more than 5% across the entire visible light range. The composition is solid at room temperature and therefore easy to handle. Further, the composition is useful for producing an opaque silicone adhesive sheet. A cured product obtained by curing the composition can be used to protect a liquid crystal electrode and shield the electrode from light, thereby preventing malfunction of the driver IC, and also exhibits excellent mechanical properties and flexibility, and displays minimal surface tack.
A curable silicone resin composition that is solid at room temperature, the composition comprising:
A silicone resin cured product obtained by curing a curable silicone resin composition that is solid at room temperature and that comprises:
A cured product obtained by curing a curable silicone resin composition, the cured product having a light transmittance of not more than 5% across an entire visible light range when formed as a layer with a thickness of 100 μm, wherein
An opaque silicone adhesive sheet formed from a curable silicone resin composition that is solid at room temperature and that comprises:
A method of protecting an electronic component and shielding the electronic component from light, the method comprising adhering or pressure bonding a curable silicone resin composition to a surface of the electronic component, and then curing the composition, wherein
Dependencies are inferred from the claim text.