System and method for plasma plating

A system for plasma plating comprising:

• a vacuum chamber at a pressure defined by a range that extends from 0.1 milliTorr to 4 milliTorr;
• a filament positioned within the vacuum chamber and operable to receive a depositant;
• a depositant positioned at the filament;
• a platform positioned within the vacuum chamber;
• a substrate positioned at the platform;
• a DC power supply generating a DC signal at a voltage amplitude defined by a range that extends from 1 volt to 5000 volts;
• a radio frequency transmitter generating a radio frequency signal at a power level defined by a range that extends from 1 watt to 50 watts;
• an electrically conductive path that electrically couples the DC signal and the radio frequency signal to the substrate;
• and
• a filament power control electrically coupled to the filament and generating a current through the filament at an amplitude to generate heat in the filament to melt the depositant.