Light emitting diode device
AssigneeFoxconn Technology Co., Ltd.
InventorsPai-Sheng Wei, Chia-Shou Chang
Life of this patent
Estimating the term…
Abstract
An exemplary light emitting diode (LED) device includes a base, a plurality of LED chips, a plurality of encapsulation materials and a heat dissipation substrate. The LED chips are mounted on a top surface of the base. The encapsulation materials are provided on the top surface of the base and encapsulate the LED chips therein. The heat dissipation substrate is fixedly attached to a bottom surface of the base. The heat dissipation substrate is of a porous material and defines a plurality of pores therein. The pores communicate with each other.
Claims14
A light emitting diode device comprising:
- a base;
- a plurality of light emitting diode chips mounted on a top surface of the base;
- a plurality of encapsulation materials provided on the top surface of the base and encapsulating the light emitting diode chips therein;
- and
- a heat dissipation substrate fixedly attached to a bottom surface of the base, the heat dissipation substrate being of a porous material and defining a plurality of pores therein, wherein the pores communicate with each other.
A light emitting diode device comprising:
- a base defining a plurality of engaging recesses at a bottom surface thereof;
- a plurality of light emitting diode chips mounted on a top surface of the base;
- and
- a heat dissipation substrate fixedly attached to the bottom surface of the base, the heat dissipation substrate forming a plurality of protrusions at a top surface thereof corresponding to the engaging recesses, the protrusions of the heat dissipation substrate being received in the engaging recesses of the base, respectively, the heat dissipation substrate being of a porous material and defining a plurality of pores therein, wherein the pores communicate with each other.
Dependencies are inferred from the claim text.