Scalable Integrated Circuit High Density Capacitors

A capacitor, comprising:

• a first, second, and third metal layer, each including a first and second metallization pattern, the first and second metallization patterns each having a plurality of interdigitated finger tracks approximately perpendicular to a respective backbone track,
• wherein a finger track in the plurality of finger tracks in the second metal layer is offset by more than one-half of a width of the finger track relative to a corresponding one of the finger tracks of the plurality of finger tracks in the first metal layer,
• wherein the first metallization patterns in the first and third metal layers are electrically coupled to the second metallization pattern in the second metal layer,
• wherein the second metallization patterns in the first and third metal layers are electrically coupled to the first metallization pattern in the second metal layer,
• wherein a portion of a finger track in the pluralities of finger tracks in the first and second metallization patterns in the first metal layer overlaps a portion of a finger track in the pluralities of finger tracks in the first and second metallization patterns in the second metal layer,
• wherein an end of the backbone track in the first metallization pattern in the first metal layer is electrically coupled to a wire,
• wherein a finger track in the plurality of finger tracks in the first metallization pattern in the first metal layer, extending from a non-distal and non-proximal portion of the backbone track in the first metallization pattern in the first metal layer, does not completely overlap any finger tracks in the plurality of finger tracks in the second metal layer,
• wherein the backbone track in the first metallization pattern in the first metal layer is an interdigitated element of a third metallization pattern,
• wherein at least one of the first and second metallization patterns in the first metal layer is electrically coupled to a side shield, and
• wherein a finger track in the plurality of finger tracks in the first metallization pattern in the first metal layer is wider than a distance between the finger track, in the plurality of finger tracks in the first metallization pattern in the first metal layer, and an adjacent finger track in the plurality of finger tracks in the first metallization pattern in the first metal layer.