Back to results
US 2009/0290273 A1Published application
Light-emitting diode package having electrostatic discharge protection function and method of fabricating the same
AssigneeIndustrial Technology Research Institute
InventorsChih-Tsung Shih, Chen-Peng Hsu, Shih-Tsai Huang, Hsin-Yun Tsai, Hung-Lieh Hu
Life of this patent
Estimating the term…
Abstract
A light-emitting diode (LED) package having electrostatic discharge (ESD) protection function and a method of fabricating the same adopt a composite substrate to prepare an embedded diode and an LED, and use an insulating layer in the composite substrate to isolate some individual embedded diodes, such that the LED device has the ESD protection.
Claims28
An light-emitting diode (LED) package having an electrostatic discharge (ESD) protection function, comprising:
- a composite substrate, comprising a first semiconductor region, a second semiconductor region, and a groove located between the first semiconductor region and the second semiconductor region;
- a first electrode, disposed between the first semiconductor region and the groove;
- at least one second electrode, disposed in the first semiconductor region or between the second semiconductor region and the groove, wherein the first electrode is electrically insulated from the second electrodes, and the second electrodes are electrically connected to each other;
- at least one LED, disposed in the groove and having two electrode ends electrically connected to the first electrode and one of the second electrodes respectively;
- and
- an embedded electronic device, embedded in the first semiconductor region and having two electrode ends, wherein the two electrode ends of the embedded electronic device are electrically connected to the first electrode and another second electrode respectively, the embedded electronic device includes at least one embedded diode, and a forward bias direction of the embedded diode relative to the first electrode and the second electrodes is opposite to that of the LED relative to the first electrode and the second electrodes.
3 more elements
A method of fabricating a light-emitting diode (LED) package having an electrostatic discharge (ESD) protection function, comprising:
- providing a composite substrate that comprises a first silicon substrate, an insulating layer, and a second silicon substrate arranged in sequence;
- forming a embedded diode in the first silicon substrate;
- forming a groove in the first silicon substrate, wherein the groove is adjacent to the embedded diode, and recesses from a first surface of the first silicon substrate to a second surface of the first silicon substrate, so as to separate two independent semiconductor regions;
- forming at least one isolation trench in the second silicon substrate and the insulating layer, wherein the isolation trench recesses from a first surface of the second silicon substrate to a second surface of the insulating layer, and the groove is disposed corresponding to the isolation trench, for dividing the composite substrate into a positive electrode contact surface and at least one negative electrode contact surface of the composite substrate;
- forming a plurality of electrodes respectively on the positive electrode contact surface and the negative electrode contact surface, for defining a positive electrode and a negative electrode of the composite substrate, wherein the composite substrate is electrically connected to the embedded diode, and an electrode direction of the embedded diode is opposite to that of the composite substrate;
- and
- disposing at least one LED in the groove, wherein the LED has a positive electrode and a negative electrode electrically connected to the positive electrode and the negative electrode of the composite substrate respectively.
4 more elements
An electrostatic discharge (ESD) protection system for a light-emitting diode (LED), comprising:
- a composite substrate, comprising a first silicon substrate, an insulating layer, and a second silicon substrate arranged in sequence, wherein the composite substrate has a groove and an isolation trench corresponding to the groove, the groove and the isolation define the composite substrate as a contact surface positive electrode and a contact surface negative electrode of the composite substrate, the composite substrate further comprises an ESD protection circuit embedded in the first silicon substrate and the second silicon substrate alternatively;
- and
- an LED, disposed in the groove and having two electrode ends which are electrically connected to the positive electrode contact surface and the negative electrode contact surface respectively, and being electrically connected to the ESD protection circuit, wherein an electrode direction of the ESD protection circuit is opposite to that of the LED.
Dependencies are inferred from the claim text.