Multi-chip module package including external and internal electrostatic discharge protection circuits, and/or method of making the same

A method of making a multi-chip module (MCM) package, the method comprising:

• providing a plurality of external IO pads;
• locating a plurality of external ESD protection circuits under the external IO pads;
• providing a plurality of dies or integrated circuits (ICs);
• providing a plurality of internal bond pads to the dies or integrated circuits;
• locating a plurality of internal ESD protection circuits under the internal bonding pads;
• and
• connecting the plurality of dies or ICs to each other via connections among and/or between the plurality of internal bond pads, wherein the plurality of external ESD protection circuits provides a higher level of voltage protection than the plurality of internal ESD protection circuits.

A multi-chip module (MCM) package, comprising:

• a plurality of external IO pads;
• a plurality of external electrostatic discharge (ESD) protection circuits located under the external IO pads;
• a plurality of dies or integrated circuits;
• a plurality of internal bond pads provided to the dies or integrated circuits, the plurality of dies or integrated circuits being connected to each other via connections among and/or between the plurality of internal bond pads respectively provided thereto;
• and
• a plurality of internal electrostatic discharge (ESD) protection circuits located under the internal bonding pads,
• wherein the plurality of external ESD protection circuits provides a higher level of voltage protection than the plurality of internal ESD protection circuits, and
• wherein the external and/or internal ESD protection circuits comprise one or more diodes.