Inspecting Method and Inspecting Apparatus for Substrate Surface
AssigneeHitachi High-Technologies Corporation
InventorsAkira HAMAMATSU, Yoshimasa Oshima, Shunji Maeda, Hisae Shibuya, Yuta Urano, Toshiuki Nakao, Shigenobu Maruyama
Life of this patent
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Abstract
To inspect a substrate such as a semiconductor substrate for surface roughness at high precision. The surface roughness of the substrate is measured in each frequency band of the surface roughness by applying a light to the substrate surface and detecting a scattered light or reflected light at a plurality of azimuth or elevation angles.
Claims16
An inspecting method for inspecting a substrate surface, characterized by including:
- a first step of applying a light to the substrate surface;
- a second step of detecting a scattered light or reflected light from the substrate surface due to the applied light at a plurality of positions to obtain a plurality of electrical signals;
- a third step of extracting a signal in a mutually different frequency band from each of the plurality of electrical signals;
- and
- a fourth step of calculating a value regarding the surface roughness of the substrate surface through an arithmetical operation process of a plurality of extracted signals in the frequency bands.
An inspecting apparatus for inspecting a substrate surface, characterized by comprising:
- an illuminating optical system for applying a light to the substrate surface;
- a plurality of detecting optical systems for detecting a scattered light or reflected light from the substrate surface due to the applied light at a plurality of positions to obtain a plurality of electrical signals;
- and
- a processing section for extracting a signal in a mutually different frequency band from each of the plurality of electrical signals, and calculating a value regarding the surface roughness of the substrate surface through an arithmetical operation process of a plurality of extracted signals in the frequency bands.
An inspecting method for inspecting a substrate surface, characterized by including:
- a first step of applying a light to the substrate surface;
- a second step of detecting a scattered light or reflected light from the substrate surface due to the applied light at a plurality of positions to obtain a plurality of electrical signals;
- and
- a third step of calculating a plurality of values regarding the surface roughness of the substrate surface through an arithmetical operation process of the plurality of signals.
Dependencies are inferred from the claim text.