Method of encapsulating optoelectronic components
AssigneeTesa SE
InventorsAXEL BURMEISTER, Franziska Zmarsly
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Abstract
Method of encapsulating optoelectronic components, by embedding the components to be encapsulated between a first transparent polymer layer and a second polymer layer, which is filled with unactivated foaming agent, and then activating the foaming agent, so that the two polymer layers join to one another, in particular weld to one another, and the components are enclosed between the two polymer layers.
Claims11
Method of encapsulating optoelectronic components, by embedding the components to be encapsulated between a first transparent polymer layer and a second polymer layer, which is filled with unactivated foaming agent, and then activating the foaming agent, so that the two polymer layers join to one another, and the components are enclosed between the two polymer layers.
Dependencies are inferred from the claim text.