Semiconductor device, semiconductor device module, and method for manufacturing the semiconductor device module

A semiconductor device module comprising:

• a semiconductor device-mounting substrate including a circuit pattern formed thereon;
• and
• a semiconductor device mounted on the semiconductor device-mounting substrate, the semiconductor device including:
• a substrate,
• a plurality of semiconductor elements mounted on the substrate and each of the plurality of semiconductor elements including a first potential applied electrode and a second potential applied electrode,
• a first wiring pattern formed on the substrate and electrically connected to the first potential applied electrodes of the plurality of semiconductor elements, and
• a second wiring pattern formed on the substrate and electrically connected to the second potential applied electrodes of the plurality of semiconductor elements,
• wherein the first wiring pattern includes a wiring trace group including a plurality of separate wiring traces connected to the first potential applied electrodes of the plurality of semiconductor elements, and
• wherein the wiring trace group includes a bonding area bonded to the semiconductor device-mounting substrate, the separate wiring traces of the first wiring pattern being electrically connected to each other in the bonding area.

A method for manufacturing a semiconductor device module comprising:

• providing a semiconductor device-mounting substrate and a semiconductor device wherein:
• the semiconductor device-mounting substrate includes a circuit pattern formed thereon;
• and
• the semiconductor device includes:
• a substrate;
• a plurality of semiconductor elements mounted on the substrate and each of plurality of semiconductor elements includes a first potential applied electrode and a second potential applied electrode;
• a first wiring pattern formed on the substrate and electrically connected to the first potential applied electrodes of the plurality of semiconductor elements;
• and
• a second wiring pattern formed on the substrate and electrically connected to the second potential applied electrodes of the plurality of semiconductor elements;
• preparing the semiconductor device in which the first wiring pattern includes a wiring trace group including a plurality of electrically independent wiring traces connected to the first potential applied electrodes of the plurality of semiconductor elements;
• applying a solder material to a predetermined position on the circuit pattern;
• and
• mounting the semiconductor device on the semiconductor device-mounting substrate such that the plurality of electrically independent wiring traces are electrically connected to each other in a part of the wiring trace group through the solder material.