Wirebondless Wafer Level Package with Plated Bumps and Interconnects

A method of making a semiconductor package, comprising:

• providing a substrate having a die cavity and a plurality of bump cavities;
• mounting a semiconductor die in the die cavity of the substrate, a top surface of the semiconductor die being approximately coplanar with a top surface of the substrate proximate to the die cavity;
• depositing a metal layer into one of the plurality of bump cavities of the substrate to form a package bump;
• connecting the package bump and a contact pad of the semiconductor die;
• depositing encapsulant over the semiconductor package;
• and
• removing the substrate.

A method of making a semiconductor package, comprising:

• providing a substrate having a die cavity and a bump cavity;
• mounting a semiconductor die in the die cavity of the substrate;
• depositing a metal layer over the package, the metal layer forming a package bump and an interconnect between the package bump and a contact pad of the first semiconductor die;
• depositing encapsulant over the semiconductor package;
• and
• removing the substrate.

A semiconductor package, comprising:

• a semiconductor die mounted to the package with an underfill material;
• a metal layer deposited over the package to form a package bump, the package bump and a contact pad of the semiconductor die being connected;
• and
• encapsulant deposited over the semiconductor package.