Circuit board, lead frame, semiconductor device, and method for fabricating the same

A semiconductor device, comprising:

• an element mounting member including a first electrode and having a first region in the shape of a quadrilateral in plan view and a second region in the shape of a quadrilateral in plan view larger than the first region;
• a semiconductor element mounted on the first region and including a second electrode;
• and
• a plurality of interposer elements mounted on the element mounting member with a first side of each of the interposer elements facing a side of the semiconductor element, each of the interposer elements including
• a first interposer electrode electrically connected to the second electrode via a first wire,
• a second interposer electrode electrically connected to the first electrode, and
• an internal interconnection electrically connecting the first interposer electrode and the second interposer electrode to each other, wherein
• each of the interposer elements is placed in such a manner that the first side at least partially overlaps a side of the quadrilateral of the first region and a second side of each of the interposer elements overlaps a side of the quadrilateral of the second region.

A method for fabricating a semiconductor device, the method comprising the steps of:

• (a) preparing an element mounting member including a first electrode, a semiconductor element including a second electrode, and an interposer element including a first interposer electrode and a second interposer electrode electrically connected to each other via an internal interconnection;
• (b) mounting, on the element mounting member, the semiconductor element and the interposer element in such a manner that the semiconductor element and the interposer element are spaced apart from each other with a first side of the interposer element facing a side of the semiconductor element;
• (c) connecting the first electrode and the first interposer electrode to each other by a wire;
• and
• (d) connecting the second electrode and the second interposer electrode to each other, wherein
• in step (a), the interposer element is one of a triangle and a trapezoid in plan view.