Thermal sensing and reset protection for an integrated circuit chip

A semiconductor package comprising:

• a semiconductor die mounted on a package substrate and including a thermal sensing and reset protection circuit;
• said thermal sensing and reset protection circuit being configured to determine a temperature of said first semiconductor die and to provide a reset protection signal to said first semiconductor die when said temperature is substantially equal to a preset temperature so as to protect said first semiconductor die from thermal runaway.

A method for providing thermal protection for a first semiconductor die mounted on a package substrate in a semiconductor package, said method comprising:

• sensing a temperature of said first semiconductor die by utilizing a thermal sensing and reset protection circuit in a second semiconductor die mounted on said first semiconductor die;
• and
• providing a reset protection signal to said first semiconductor die from said thermal sensing and reset protection circuit when said temperature of said first semiconductor die is substantially equal to a preset temperature so as to protect said first semiconductor die from thermal runaway.