Package structure of light emitting diode and method of manufacturing the same

A method of manufacturing a light emitting device, the method comprising:

• forming auxiliary leads and main leads by performing a perforating process on a base frame having a base portion with a first thickness and a heat-dissipating portion extending downwardly from the base portion and having a second thickness greater than the first thickness, the base frame having a chip mounting portion formed at the center of its top surface, the perforating process performed on the base portion of the base frame, the auxiliary leads each connected between opposite ends of the base portion and the heat-dissipating portion, and the main leads each having one end isolated from the heat-dissipating portion and the other end connected to the end of the base portion;
• forming a molding cap including a portion of the heat-dissipating portion and portions of the auxiliary leads and the main leads, the molding cap formed through molding such that the main lead portion adjacent to the heat-dissipating portion and the chip mounting portion are exposed outside together;
• and
• forming structures of the auxiliary leads and main leads such that first horizontal portions extend along the same level with the top surface of heat-dissipating portion to be spaced apart from the molding cap by a predetermined distance, vertical portions are bent downward from the first horizontal portions, and second horizontal portions extend from distal ends of the vertical portions along the same level with the bottom surface of the heat-dissipating portion.

A method of manufacturing a light emitting device, the method comprising:

• forming auxiliary leads and main leads by performing a perforating process on a base frame having a base portion with a first thickness and a heat-dissipating portion extending downwardly from the base portion and having a second thickness greater than the first thickness, the base frame having a chip mounting portion formed at the center of its top surface, the perforating process performed on the base portion of the base frame, the auxiliary leads each connected between opposite ends of the base portion and the heat-dissipating portion, and the main leads each having one end isolated from the heat-dissipating portion and the other end connected to the end of the base portion;
• forming structures of the auxiliary leads and main leads such that first horizontal portions extend from the heat-dissipating portion along the same level with the top surface of the heat-dissipating portion by a predetermined length, vertical portions are bent downward from the first horizontal portions, and second horizontal portions extend from distal ends of the vertical portions along the same level with the bottom surface of the heat-dissipating portion;
• forming a molding cap including a portion of the heat-dissipating portion and portions of the auxiliary leads and the main leads, the molding cap formed through molding such that the first horizontal portions extending along the same level with the top surface of the heat-dissipating portion and the chip mounting portion are partially exposed outside from the vertical portions together with the chip mounting portion;
• and
• mounting a light emitting diode (LED) chip on the chip mounting portion and wire-bonding the LED chip and the first horizontal portions of the main leads to each other.