Semiconductor Wafer and Method of Forming Sacrificial Bump Pad for Wafer Probing During Wafer Sort Test

A method of making a semiconductor device, comprising:

• providing a semiconductor wafer containing a plurality of semiconductor die;
• concurrently forming a plurality of interconnect bump pads, a plurality of sacrificial bump pads, and conductive link over the semiconductor die, the sacrificial bump pads being disposed in proximity to the interconnect bump pads, the conductive link being electrically connected between each interconnect bump pad and proximate sacrificial bump pad;
• and
• wafer probing by electrically contacting the sacrificial bump pads.

A method of making a semiconductor device, comprising:

• providing a semiconductor wafer containing a plurality of semiconductor die;
• forming an interconnect bump pad over the semiconductor die within a bump pad array;
• forming a sacrificial bump pad within the bump pad array;
• forming a conductive link between the interconnect bump pad and sacrificial bump pad;
• and
• wafer probing by electrically contacting the sacrificial bump pad.

A semiconductor wafer containing a plurality of semiconductor die, comprising:

• an interconnect bump pad formed over the semiconductor die within a bump pad array;
• a sacrificial bump pad formed within the bump pad array;
• and
• a conductive link formed between the interconnect bump pad and sacrificial bump pad.