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US 2009/0289097 A1Published application
Wafer Leveling-Bonding System Using Disposable Foils
OwnerWeng-Jin Wu, Wen-Chih Chiou +1inventors
InventorsWeng-Jin Wu, Wen-Chih Chiou, Chen-Hua Yu
Life of this patent
Estimating the term…
Abstract
A leveling-bonding method and an apparatus for performing the same are provided. The method includes providing a bond support for supporting a wafer; providing a bond head over the bond support; dispatching a foil over the wafer; placing the wafer on the bond support; and using the bond support and the bond head to apply a force on the foil and the wafer.
Claims19
An apparatus for bonding a wafer, the apparatus comprising:
- a bond support for supporting the wafer;
- a bond head over the bond support, wherein the bond support and the bond head are configured to move relative to each other;
- and
- a foil dispatcher configured to dispatch a foil onto, and to remove the foil from over, the wafer.
1 more element
(canceled)
An apparatus for bonding a wafer, the apparatus comprising:
- a bond support for supporting the wafer;
- a bond head over the bond support and having a surface facing the bond support, wherein the bond head is free from a polymer material;
- a robot handler for loading the wafer onto, and unloading the wafer from, the bond support;
- a foil free from adhesives on both sides, and having a size no smaller than a size of the wafer;
- and
- a foil dispatcher configured to dispatch the foil onto, and to remove the foil from over, the wafer.
3 more elements
(canceled)
An apparatus for bonding a wafer, the apparatus comprising:
- a bond support for supporting the wafer;
- a first bond head over the bond support and having a surface facing the bond support, wherein the first bond head and the bond support are configured to move relative to each other;
- a second bond head over, and having a clearance from, the first bond head, wherein the clearance is adequate for placing the wafer, and wherein the first and the second bond heads are free from polymer materials, and are configured to move relative to each other;
- a robot handler for loading the wafer onto, and unloading the wafer from, at least one of the bond support and the first bond head;
- and
- a foil dispatcher configured to dispatch a foil onto, and to remove the foil from over, the wafer, wherein the foil dispatcher is configured to dispatch wafer-size foils.
3 more elements
Dependencies are inferred from the claim text.