Wired circuit board and producing method thereof
AssigneeNitto Denko Corporation
InventorsYasushi Tamura, Hayato Abe, Katsuhiko Kawashima
Life of this patent
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Abstract
A wired circuit board includes an insulating base layer, a conductive pattern formed on the insulating base layer, a tin-based thin layer formed on a surface of the conductive pattern, and containing at least tin oxide, and an insulating cover layer formed on the insulating base layer so as to cover the tin-based thin layer.
Claims10
A wired circuit board comprising:
- an insulating base layer;
- a conductive pattern formed on the insulating base layer;
- a tin-based thin layer formed on a surface of the conductive pattern, and containing at least tin oxide;
- and
- an insulating cover layer formed on the insulating base layer so as to cover the tin-based thin layer.
A wired circuit board obtained by a producing method of a wired circuit board, the producing method comprising:
- forming an insulating base layer;
- forming a conductive pattern on the insulating base layer;
- forming a tin layer on a surface of the conductive pattern;
- heating the tin layer in vacuum to a temperature of not less than 350° C.;
- cooling, after the heating, the tin layer under an atmospheric pressure to form a tin-based thin layer containing at least tin oxide;
- and
- forming an insulating cover layer on the insulating base layer so as to cover the tin-based thin layer.
A wired circuit board obtained by a producing method of a wired circuit board, the producing method comprising:
- forming an insulating base layer;
- forming a conductive pattern on the insulating base layer;
- forming a tin layer on a surface of the conductive pattern;
- heating the tin layer in vacuum to a temperature of not less than 350° C.;
- cooling, after the heating, the tin layer in vacuum;
- heating, after the cooling, the tin layer to a temperature of not less than 150° C. under an atmospheric pressure to form a tin-based thin layer containing at least tin oxide;
- and
- forming an insulating cover layer on the insulating base layer so as to cover the tin-based thin layer.
A producing method of a wired circuit board, the producing method comprising:
- forming an insulating base layer;
- forming a conductive pattern on the insulating base layer;
- forming a tin layer on a surface of the conductive pattern;
- heating the tin layer in vacuum to a temperature of not less than 350° C.;
- cooling, after the heating, the tin layer under an atmospheric pressure to form a tin-based thin layer containing at least tin oxide;
- and
- forming an insulating cover layer on the insulating base layer so as to cover the tin-based thin layer.
A producing method of a wired circuit board, the producing method comprising:
- forming an insulating base layer;
- forming a conductive pattern on the insulating base layer;
- forming a tin layer on a surface of the conductive pattern;
- heating the tin layer in vacuum to a temperature of not less than 350° C.;
- cooling, after the heating, the tin layer in vacuum;
- heating, after the cooling, the tin layer to a temperature of not less than 150° C. under an atmospheric pressure to form a tin-based thin layer containing at least tin oxide;
- and
- forming an insulating cover layer on the insulating base layer so as to cover the tin-based thin layer.
Dependencies are inferred from the claim text.