Non-cylinder via structure and thermal enhanced substrate having the same
AssigneeSubtron Technology Co., Ltd.
InventorsWen-Cheng Ho, Tzu-Shih Shen
Life of this patent
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Abstract
A thermal enhanced substrate having a non-cylinder via structure includes at least a metal layer disposed on an insulating base material and a number of thermal channels respectively constituted by at least a trough pattern penetrating the insulating base material and a conductive material deposited in the trough pattern. The trough pattern serves as a non-cylinder via structure having at least an elongated hole for heat dissipations so as to reduce a working temperature of an electronic device.
Claims12
A non-cylinder via structure, suitable for being used in a thermal enhanced substrate, the thermal enhance substrate supporting an electronic device and having at least a metal layer and a plurality of thermal channels, the thermal channels respectively comprising at least a trough pattern penetrating the thermal enhance substrate and a conductive material deposited in the trough pattern, wherein the trough pattern serves as the non-cylinder via structure having at least an elongated hole.
A thermal enhanced substrate, suitable for supporting an electronic device, the thermal enhanced substrate comprising:
- at least a metal layer, disposed on an insulating base material;
- and
- a plurality of thermal channels, respectively comprising at least a trough pattern penetrating the insulating base material and a conductive material deposited in the at least a trough pattern,
- wherein the trough pattern serves as a non-cylinder via structure having at least an elongated hole.
Dependencies are inferred from the claim text.