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US 2009/0288852 A1Published application
Electronic device and method of manufacturing the same
AssigneeNEC Electronics Corporation
InventorsTomoaki Hirokawa, Makoto Matsunoshita, Yuji Kakuta, Naoki Sakura
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Abstract
An electronic device of the present invention has a substrate; an electro-conductive pattern (electrodes) provided over the substrate; a semiconductor chip mounted over the substrate, and electrically connected with the electrodes; a resin cap provided over the substrate and composed of two or more resin layers to hollow-sealing the semiconductor chip; and an adhesive layer (metal-resin adhesion maintenance layer) bonding the resin cap with the electrode.
Claims13
An electronic device comprising:
- a substrate;
- an electro-conductive pattern provided over said substrate;
- an electronic component mounted over said substrate, and electrically connected to said electro-conductive pattern;
- a resin cap provided over said substrate, and composed of two or more resin layers hollow-sealing said electronic component;
- and
- an adhesive layer bonding said resin cap with said electro-conductive pattern.
3 more elements
A method of manufacturing an electronic device comprising:
- preparing a substrate having an electro-conductive pattern formed thereon;
- forming an adhesive layer over said electro-conductive pattern provided over said substrate;
- mounting an electronic component over said substrate, and electrically connecting said electronic component with said electro-conductive pattern;
- and
- bonding a resin cap composed of two or more resin layers with said electro-conductive pattern while placing said adhesive layer in between, so as to hollow-seal said electronic component.
2 more elements
Dependencies are inferred from the claim text.