Substrate bonding apparatus

Abstract

To provide a substrate bonding apparatus for manufacturing a substrate with a retainer capable of meeting standard requirements while reducing damage on the information recording surface of the substrate. The apparatus comprises a loading pedestal 11 on which a plate-shaped substrate D is placed; a suctioning and holding member 21 (see FIG. 2) for suctioning and holding a plate-shaped retainer R smaller than the substrate D on a side opposite the loading pedestal 11 beyond the substrate D placed on the loading pedestal 11; a moving device 13m for bringing the loading pedestal 11 and the suctioning and holding member 21 close toward each other so that the substrate D placed on the loading pedestal 11 and the retainer R suctioned and held with the suctioning and holding member 21 connected through adhesive; and a pressing member 25 for pressing down the substrate D placed on the loading pedestal 11 so that the substrate D does not come off the loading pedestal 11. The pressing member facilitates the retainer be bonded to the substrate while preventing the substrate from drawn via adhesive to come off the loading pedestal.

Dependencies are inferred from the claim text.