Board or electronic component warp analyzing method, board or electronic component warp analyzing system and board or electronic component warp analyzing program

An electronic component warp analysis method of analyzing a warp of an electronic component, comprising, in electronic component warp calculation based on model data including at least a configuration and an elastic constant of said electronic component, the processing of:

• dividing a temperature profile indicative of a relationship between a temperature and a time with respect to said electronic component by a predetermined time,
• obtaining a relaxation elastic modulus of said electronic component corresponding to the divisional time by shifting on a time base of a master curve related to said electronic component which is composed with respect to a reference temperature based on a temperature-time conversion rule,
• calculating a curing degree of said electronic component based on a relationship between a time after shift and an actually applied temperature, and
• analyzing a warp of said electronic component based on a relaxation elastic modulus on said master curve corresponding to said curing degree or a relaxation elastic modulus calculated based on a relationship between said curing degree and said elastic constant according to a value of said curing degree calculated.

A board warp analysis system of analyzing a warp of a board, comprising,

• in board warp calculation based on model data including at least a configuration and an elastic constant of said board and an electronic component mounted on said board, comprising:
• division unit for dividing a temperature profile indicative of a relationship between a temperature and a time with respect to said electronic component by a predetermined time,
• obtaining unit for obtaining a relaxation elastic modulus of said electronic component corresponding to the divisional time by shifting on a time base of a master curve related to said electronic component which is composed with respect to a reference temperature based on a temperature-time conversion rule,
• curing degree calculation unit for calculating a curing degree of said electronic component based on a relationship between a time after shift and an actually applied temperature, and
• analysis unit for analyzing a warp and a stress of said electronic component based on a relaxation elastic modulus on said master curve corresponding to said curing degree or a relaxation elastic modulus calculated based on a relationship between said curing degree and said elastic constant according to a value of said curing degree calculated.

An electronic component warp analysis system for analyzing a warp of an electronic component, comprising,

• in electronic warp calculation based on model data including at least a configuration and an elastic constant of said electronic component:
• division unit for dividing a temperature profile indicative of a relationship between a temperature and a time with respect to said electronic component by a predetermined time,
• obtaining unit for obtaining a relaxation elastic modulus of said electronic component corresponding to the divisional time by shifting on a time base of a master curve related to said electronic component which is composed with respect to a reference temperature based on a temperature-time conversion rule,
• curing degree calculation unit for calculating a curing degree of said electronic component based on a relationship between a time after shift and an actually applied temperature, and
• an analysis unit for analyzing a warp and a stress of said electronic component based on a relaxation elastic modulus on said master curve corresponding to said curing degree or a relaxation elastic modulus calculated based on a relationship between said curing degree and said elastic constant according to a value of said curing degree calculated.

A computer readable medium for storing a board warp analysis program realized on a board warp analysis system of analyzing a warp of a board, which causes,

• in board warp calculation based on model data including at least a configuration and an elastic constant of said board and an electronic component mounted on said board,
• division unit to execute division processing of dividing a temperature profile indicative of a relationship between a temperature and a time with respect to said electronic component by a predetermined time,
• obtaining unit to execute obtaining processing of obtaining a relaxation elastic modulus of said electronic component corresponding to the divisional time by shifting on a time base of a master curve related to said electronic component which is composed with respect to a reference temperature based on a temperature-time conversion rule,
• curing degree calculating unit to execute curing degree calculation processing of calculating a curing degree of said electronic component based on a relationship between a time after shift and an actually applied temperature, and
• analysis unit to execute analysis processing of analyzing a warp and a stress of said electronic component based on a relaxation elastic modulus on said master curve corresponding to said curing degree or a relaxation elastic modulus calculated based on a relationship between said curing degree and said elastic constant according to a value of said curing degree calculated.

A computer readable medium for storing a program for analyzing a warp of an electronic component which is realized on an electronic component warp analysis system of analyzing a warp of an electronic component, which causes,

• in board warp calculation based on model data including at least a configuration and an elastic constant of said electronic component,
• division unit to execute division processing of dividing a temperature profile indicative of a relationship between a temperature and a time with respect to said electronic component by a predetermined time,
• obtaining unit to execute obtaining processing of obtaining a relaxation elastic modulus of said electronic component corresponding to the divisional time by shifting on a time base of a master curve related to said electronic component which is composed with respect to a reference temperature based on a temperature-time conversion rule,
• curing degree calculating unit to execute curing degree calculation processing of calculating a curing degree of said electronic component based on a relationship between a time after shift and an actually applied temperature, and
• analysis unit to execute analysis processing of analyzing a warp and a stress of said electronic component based on a relaxation elastic modulus on said master curve corresponding to said curing degree or a relaxation elastic modulus calculated based on a relationship between said curing degree and said elastic constant according to a value of said curing degree calculated.