Lead Implant System

A system comprising:

• a lead coupling device having a first wireless communication module, wherein the lead coupling device is adapted to receive a medical lead;
• an interface device having a second wireless communication module configured for remote communication with the first wireless module;
• a hermetically sealed medical device package;
• an implantable medical device including a connector bore and an electrical contact contained within the hermetically sealed package;
• and
• an electrical interface configured for coupling the electrical contact of the implantable medical device with the interface device, wherein the first medical device is located outside the package.

A system comprising:

• an interface device having a first wireless communication module;
• a lead coupling device including:
• a housing having a proximal opening at a proximal end and a distal opening at a distal end;
• a lead receiving channel disposed within the housing and extending from the proximal opening to the distal opening, wherein said channel is adapted to receive a medical lead;
• a second wireless communication module disposed within the housing configured for communication with the medical device;
• a pulse generator disposed within the housing for providing electrical energy;
• a processor coupled to the pulse generator;
• at least two electrical contacts mounted within the channel and coupled to the pulse generator, wherein a portion of the contacts is adapted to contact the lead;
• and
• a power source disposed within the housing and coupled to the pulse generator;
• and
• an implantable medical device programmer, wherein the programmer is configured for communication with an implantable medical device.