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US 2009/0275264 A1Published application
System and method for optical endpoint detection during cmp by using an across-substrate signal
AssigneeAdvanced Micro Devices, Inc.
InventorsMike Schlicker, Gerd Marxsen
Life of this patent
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Abstract
In a polishing process, the characteristics of the removal process may be monitored at different lateral positions to identify the clearance of the various device regions with a high degree of reliability. Consequently, upon forming sophisticated metallization structures, undue over-polishing may be avoided while at the same time providing reduced leakage currents due to enhanced material removal.
Claims25
A method, comprising:
- performing a removal process for removing material from a material layer formed above a substrate by providing relative movement between said substrate and a polishing pad, said substrate comprising a plurality of die regions;
- obtaining a measurement signal for each of a plurality of measurement positions laterally distributed across said substrate during the removal process, said plurality of measurement positions extending in a lateral direction according to a measurement distance that is at least as large as a lateral dimension of at least one of said plurality of die regions;
- and
- determining an endpoint of said removal process on the basis of a change of said measurement signal from each of said plurality of measurement positions.
1 more element
A method for determining an endpoint of a polishing process, the method comprising:
- determining a response of a substrate to a probe signal for a plurality of radially different measurement positions;
- determining a time variation of said response;
- and
- indicating said endpoint when said time variation of said response is less than a predetermined threshold.
1 more element
A polishing system, comprising:
- a polishing tool comprising a polishing head for receiving a substrate and a polishing platen, said polishing tool being configured to establish a relative motion between said polishing head and said polishing platen;
- a detection system configured to provide a probe signal and to receive a response to said probe signal during said relative motion;
- and
- a control unit operatively connected to said polishing tool and said detection system and configured to control said polishing tool and said detection system to obtain said response for a plurality of radially different measurement positions and to monitor a time variation of said response for said plurality of measurement positions.
1 more element
Dependencies are inferred from the claim text.