Process for the collective fabrication of microstructures consisting of superposed elements

A process for the collective fabrication of structures having two superposed elements bonded together, starting from two plates a first plate including an array of first elements to which second elements belonging to the second plate have to be bonded, the first plate including electronic circuitry elements protected by an insulating protective layer, the process comprising the following steps:

• the lower face of the second plate is bonded to the upper face of the first plate, over the major portion of their respective surfaces, but not bonding the zones that are formed by etching indentations in the insulating protective layer on the first plate;
• and
• the plates are diced into individual structures including two superposed elements, comprising a lower plate element and an upper plate element, the dicing operations comprising at least dicing of an element of the second plate via its topside along a first dicing line passing along a dicing path, and dicing of an element of the first plate, located beneath the element of the second plate, via the underside along a second dicing line passing along the same dicing path but not superposed with the first dicing line, so that a portion of the lower plate element, lying between the two dicing lines, is not covered by the upper plate element.