Compound, positive resist composition and method for formation of resist pattern
AssigneeTokyo Ohka Kogyo Co., Ltd.
InventorsDaiju Shiono, Hideo Hada
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AssigneeTokyo Ohka Kogyo Co., Ltd.
InventorsDaiju Shiono, Hideo Hada
Estimating the term…
The present invention provides a compound that can be used within a resist composition, an intermediate compound for the compound, a positive resist composition, and a method for forming a resist pattern. The present invention discloses a compound represented by a general formula (A-1) shown below [wherein, R′ represents a hydrogen atom or an acid dissociable, dissolution inhibiting group, provided that at least one of the plurality of R′ groups represents an acid dissociable, dissolution inhibiting group; R″ represents an alkyl group of 1 to 10 carbon atoms; R11 to R17 each independently represents an alkyl group of 1 to 10 carbon atoms or an aromatic hydrocarbon group, which may include a hetero atom within the structure; g and j each independently represents an integer of 1 or greater, and k and q each represents an integer of 0 or greater; a represents an integer of 1 to 3; b represents an integer of 1 or greater, and l and m each independently represents an integer of 0 or greater; c represents an integer of 1 or greater, and n and o each independently represents an integer of 0 or greater; and A represents a group represented by a general formula (Ia) shown below, a group represented by a general formula (Ib) shown below, or an aliphatic cyclic group].
A compound represented by a general formula (A-0) shown below:
A compound represented by a general formula (A-1) shown below:
A positive resist composition, comprising a base material component (A) that exhibits increased alkali solubility under action of acid, and an acid generator component (B) that generates acid upon irradiation, wherein
A method for forming a resist pattern, comprising:
Dependencies are inferred from the claim text.