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OwnerYoshikazu MORIYAMA, Hideaki NISHIKAWA +4inventors
InventorsYoshikazu MORIYAMA, Hideaki NISHIKAWA, Masayoshi YAJIMA, Hiroshi FURUTANI, Shinichi MITANI, Michio NISHIBAYASHI
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An object of the present invention is to provide a coating apparatus in which the substrate can be reliably rotated at high speed. Another object of the invention is to provide a coating method of forming a coating on a substrate while reliably rotating it at high speed. A coating apparatus includes a susceptor for supporting a silicon wafer, and a rotating portion for rotating the susceptor. The rotating portion is covered on top with the susceptor to form a P2 region. The contact surface of the susceptor with the silicon wafer has a plurality of holes therein. The silicon wafer is attached to the susceptor by evacuating gas from the P2 region.
A coating apparatus for forming a coating on a substrate which has been introduced into a coating chamber, said coating apparatus comprising:
A method of forming a coating on a substrate placed in a coating chamber, said method comprising the steps of:
Dependencies are inferred from the claim text.