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AssigneeAlphasem AG
InventorJoachim Trinks
Estimating the term…
In a method and in an apparatus for the placement of electronic components (1) onto a substrate (2) at a placement station (3), the component bearing by a bearing side (4) at a supply station is picked up by means of a primary tool (6) and is transported away by means of a rotational movement and is transferred to at least one pivoting tool (41, 42). In this case, the path of the component between the plane (47) of the supply station and a provision plane (7) located at a higher level is covered in at least two separate curve movements. In the provision plane, the component is accepted by at least one secondary tool, is transported over the substrate and is deposited there. Depending on whether the primary tool transfers the component first to an intermediate pivoting tool (41) or directly to a final pivoting tool (42), the component can be placed onto the substrate once again by the same bearing side or else by its structure side.
1-28. (canceled)
A method for the placement of electronic components (1), in particular semiconductor chips, on a substrate (2) at a placement station (3), wherein the component bearing by a bearing side (4) at a supply station (5) is acquired by means of a primary tool (6) at a structure side (17) remote from the bearing side, is picked up and is transported by means of a rotational movement above the plane (47) of the supply station, and wherein the component is accepted by at least one secondary tool (8) in a provision plane (7) lying above the plane (47) of the supply station, is transported over the substrate and is deposited there, characterized in that the path of the component between the plane (47) of the supply station and the provision plane (7) is covered in at least two separate, ascending curve movements, wherein the primary tool (6) transfers the component to at least one pivoting tool (41, 42) in a transfer position.
An apparatus for the placement of electronic components (1), in particular semiconductor chips, on a substrate (2) at a placement station (3), wherein the component bearing by a bearing side (4) at a supply station (5) can be picked up by means of a primary tool (6) at a structure side (17) remote from the bearing side and by means of which the component can be transported above the plane (47) of the supply station, wherein the component can be accepted by at least one secondary tool (8) in a provision plane (7) lying above the plane (47) of the supply station, can be transported over the substrate (2) and can be deposited there, characterized in that at least one pivoting tool (41, 42) is arranged in the operative region of the primary tool (6), and a component can be transferred to said at least one pivoting tool from the primary tool (6) in a transfer position, wherein the path of the component between the plane (47) of the supply station and the provision plane (7) can be covered in at least two separate, ascending curve movements.
Dependencies are inferred from the claim text.