US 2009/0269075 A1Published application

Electro-optical assembly and method for making an electro-optical assembly

AssigneeAvago Technologies Fiber IP Pte Ltd

InventorsTom Sheau Tung Wong, Adrianus Van Haasteren, Tze Wei Lim

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Abstract

An electro-optical assembly (EA) is provided in which the transmitter and receiver components are integrated together on a single circuit board, which is encapsulated in a single molded EA package. Integrating the transmitter and receiver components on a single circuit board allows the size and complexity of the EA to be greatly reduced as compared to the traditional TO-can and FOT architectures. A standard semiconductor inline automation system and process may be used to manufacture the EA packages so that they may be mass produced with improved throughput, yield and quality as compared to the method currently used to manufacture and assemble the known EA used in the traditional TO-can and FOT architectures.

Claims21

Dependent claims

An electro-optical assembly (EA) comprising:

a circuit board having electrical conductors and one or more mounting surfaces;
a transmitter mounted on the circuit board and electrically connected to one or more of the electrical conductors of the circuit board, the transmitter including at least a light source for producing optical signals and a transmitter integrated circuit (IC) for driving the light source;
a receiver mounted on the circuit board and electrically connected to one or more of the electrical conductors of the circuit board, the receiver including at least a photodetector and a receiver IC, the photodetector being configured to detect optical signals and to produce electrical signals corresponding to the detected optical signals, the receiver IC having circuitry configured to process electrical signals produced by the photodetector;
and
an optically transmissive encapsulation that encapsulates at least a portion of the circuit board, the encapsulated portion of the circuit board including at least the transmitter and the receiver, the encapsulation providing a moisture barrier that prevents moisture from entering the encapsulated portion of the circuit board and providing mechanical protection of the EA.

2 more elements

A method for making an electro-optical assembly (EA) comprising:

providing a circuit board having electrical conductors and one or more mounting surfaces;
mounting a transmitter on the circuit board, the transmitter including at least a light source for producing optical signals and a transmitter integrated circuit (IC) for driving the light source;
electrically connecting one or more of the electrical conductors of the circuit board to one or more electrical conductors of the transmitter;
mounting a receiver on the circuit board, the receiver including at least a photodetector and a receiver IC;
electrically connecting one or more of the electrical conductors of the circuit board to one or more electrical conductors of the receiver, the photodetector being configured to detect optical signals and to produce electrical signals corresponding to the detected optical signals, the receiver IC having circuitry configured to process electrical signals produced by the photodetector;
and
encapsulating at least a portion of the circuit board in an optically transmissive encapsulation, the encapsulated portion of the circuit board including at least the transmitter and the receiver, the encapsulation providing a moisture barrier that prevents moisture from entering the encapsulated portion of the circuit board.

4 more elements

Dependencies are inferred from the claim text.

Facts

Application: 12/108,898Filed 24 Apr 2008
Published: 29 Oct 2009
Term ends: Not estimatedThe source records don’t support an estimate.

Classification10 codes

G02B 6/4246
Packages, e.g. shape, construction, internal or external details: bidirectionally operating package structures
H05K 1/0274
Details: optical details, e.g. printed circuits comprising integral optical means
G02B 6/4204
Packages, e.g. shape, construction, internal or external details: the coupling comprising intermediate optical elements, e.g. lenses, holograms
G02B 6/423
Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements: using guiding surfaces for the alignment

Family

US 7,708,475 B2Related patent
US 2009/0269075 A1This patent

From the US filing history. Foreign family members aren’t listed.

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