Conductive pattern forming apparatus
AssigneeHitachi, Ltd.
InventorsYuichiro SANO, Toru MIYASAKA, Shigeo NAKAMURA
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Abstract
Apparatus for forming a conductive pattern capable of stably forming a wiring pattern of a desired thickness by providing at least one thickness detection means for detecting the thickness of a formed pattern and capable of adjusting at least one of parameters such as a developing bias voltage or a concentration of a developer that contributes to the thickness of the pattern based on the information obtained from the thickness detection means.
Claims11
A pattern forming apparatus for forming a pattern of an electrostatic latent images formed on a dielectric thin film into a pattern by electrostatic adsorption of charged particles, including pattern thickness detection means for detecting the thickness of a formed pattern on a real time, and a plurality of pattern thickness adjusting means capable of increasing or decreasing the thickness of the formed pattern, wherein a pattern having a desired thickness is formed stably by adjusting at least one of the plurality of pattern thickness adjusting means based on information detected by the pattern thickness detection means.
Dependencies are inferred from the claim text.