Circuit substrate and liquid discharging apparatus
AssigneeCanon Kabushiki Kaisha
InventorKeiichi Sasaki
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AssigneeCanon Kabushiki Kaisha
InventorKeiichi Sasaki
Estimating the term…
The present invention provides a higher density, higher resolution, higher durability and lower cost circuit substrate. In a circuit substrate in which a circuit including: a plurality of heat generating elements in which a pair of electrodes opposing each other to form a predetermined gap is provided on a resistor 16 and a portion where a resistor layer is positioned between the electrodes is taken as a resistor portion; and first and second wiring layers 12 and 15 for energizing the pair of electrodes of each heat generating element; is mounted on a substrate 10, the substrate is formed of Si, the first wiring layer is formed of a metal material containing at least Si, the first wiring layer is electrically connected to the substrate, the second wiring layer is provided on the first wiring layer through a metal film 14 for preventing Si from diffusing and a resistor is provided over the second wiring layer.
A circuit substrate for use in a liquid discharging apparatus comprising:
Dependencies are inferred from the claim text.