US 2009/0267702 A1 · PRINTED CIRCUIT BOARD FOR DECREASING WIRELESS WIDE AREA NETWORK NOISE

Abstract

A printed circuit board (PCB) capable of decreasing wireless wide area network (WWAN) noise generated due to internal signal interference occurring in the PCB is disclosed. The PCB printed circuit board includes a first layer, a second layer, and at least one insulating layer formed between the first and second layers. The PCB board further includes a first signal line group disposed on the first layer while including a plurality of first signal lines each supplying a first signal, isolation patterns disposed on the first layer such that the isolation patterns are arranged between adjacent ones of the first signal lines, respectively, to prevent the adjacent first signal lines from interfering with each other, and a second signal line group disposed on the second layer while including a plurality of second signal lines each supplying a second signal different from the first signal. The second signal line group corresponds to the isolation patterns.

Claims19

Dependent claims

A printed circuit board including a first layer, a second layer, and at least one insulating layer disposed between the first and second layers, comprising:

a first signal line group disposed on the first layer while including a plurality of first signal lines each supplying a first signal;
isolation patterns disposed on the first layer such that the isolation patterns are arranged between adjacent ones of the first signal lines, respectively, to prevent the adjacent first signal lines from interfering with each other;
and
a second signal line group disposed on the second layer while including a plurality of second signal lines each supplying a second signal different from the first signal,
wherein the second signal line group corresponds to the isolation patterns.

2 more elements

A multilayer printed circuit board comprising a first layer, a first insulating layer, a ground layer, a second insulating layer, a power supply layer, a third insulating layer, and a second layer, which are sequentially laminated, further comprising:

a plurality of first signal lines disposed on the first layer, to receive a first signal;
first isolation patterns disposed on the first layer such that the first isolation patterns are arranged between adjacent ones of the first signal lines, respectively, while being electrically isolated from the first signal lines;
a plurality of first ground lines disposed on the ground layer such that the first ground lines correspond to the first isolation patterns, respectively, the first ground lines being connected to the ground;
a plurality of second signal lines disposed on the second layer, to receive a second signal;
second isolation patterns disposed on the second layer such that the second isolation patterns are arranged between adjacent ones of the second signal lines, respectively, while being electrically isolated from the second signal lines;
and
a plurality of second ground lines arranged on the power supply layer such that the second ground lines correspond to the second isolation patterns, respectively, the second ground lines being connected to the ground.

4 more elements

Dependencies are inferred from the claim text.

Printed circuit board for decreasing wireless wide area network noise

Life of this patent

Printed circuit board for decreasing wireless wide area network noise

Life of this patent

Abstract

Claims19