Through-Hole Via on Saw Streets

A semiconductor device, comprising:

• a first semiconductor die;
• a bond pad formed over a surface of the first semiconductor die;
• an insulating material disposed around a peripheral region of the first semiconductor die;
• a conductive via formed in the insulating material;
• and
• a metal trace connecting the conductive via to the bond pad.

A semiconductor device, comprising:

• a plurality of stacked semiconductor die, each semiconductor die including,
• (a) a plurality of bond pads formed over a surface of the semiconductor die,
• (b) an insulating material disposed around a peripheral region of the semiconductor die,
• (c) a plurality of conductive vias formed in the insulating material, and
• (d) a metal trace connecting one of the conductive vias to a first one of the bond pads.

A semiconductor device, comprising:

• a first semiconductor die;
• a plurality of bond pads formed over a surface of the first semiconductor die;
• an insulating material disposed around a peripheral region of the first semiconductor die;
• a plurality of conductive vias formed in the insulating material;
• and
• a metal trace connecting one of the conductive vias to a first one of the bond pads, wherein a second one of the bond pads is electrically isolated from the conductive vias.