US 2009/0267228 A1 · INTERMETALLIC DIFFUSION BLOCK DEVICE AND METHOD OF MANUFACTURE

Abstract

One embodiment of the present invention is directed to an under bump metallurgy material. The under bump metallurgy material of this embodiment includes an adhesion layer and a conduction layer formed on top of the adhesion layer. The under bump metallurgy material of this embodiment also includes a barrier layer plated on top of the conduction layer and a sacrificial layer plated on top of the barrier layer. The conduction layer of this embodiment includes a trench formed therein, the trench contacting a portion of the barrier layer and blocking a path of intermetallic formation between the conduction layer and the sacrificial layer.

Claims12

Dependent claims

An under bump metallurgy material comprising:

an adhesion layer;
a conduction layer formed on top of the adhesion layer;
a barrier layer plated on top of the conduction layer;
and
a sacrificial layer plated on top of the barrier layer;
wherein the conduction layer includes a trench formed therein, the trench contacting a portion of the barrier layer and blocking a path of intermetallic formation between the conduction layer and the sacrificial layer.

3 more elements

Dependencies are inferred from the claim text.

Facts

Application

12/111,510Filed 29 Apr 2008

Published

29 Oct 2009

Term ends

Not estimatedThe source records don’t support an estimate.

Classification12 codes

H10W 72/90
Interconnections or connectors in packages: bond pads, in general
H10W 72/019
Manufacture or treatment: of bond pads
H10W 72/01935
In liquid form, e.g. spin coating, spray coating or immersion coating: by plating, e.g. electroless plating or electroplating
H10W 72/01953
Changing the shapes of bond pads: by etching

Intermetallic diffusion block device and method of manufacture

Life of this patent

Intermetallic diffusion block device and method of manufacture

Life of this patent

Abstract

Claims12