MEMS Package Having Formed Metal Lid

A method for fabricating a package for a device, comprising the steps of:

• providing a carrier having a surface including devices and attachment stripes, each stripe spaced from a respective device and surrounding the device;
• providing an embosser having a bottom half and a top half, the top half transparent for radiation;
• the bottom half having a flat surface with rounded bulges and pointed pins, the bulge locations matching the device locations and the bulge size encompassing the device size;
• the top half having a flat surface with rounded depressions and pointed indents, the depression locations and size matching the bulge locations and size, and the indent locations and size matching the pin locations and size;
• extending a flat foil between the bottom and top embosser halves;
• closing the embosser, thereby squeezing the foil between the bottom and top halves so that the foil is formed into the shape of the depressions with flat foil portions remaining between the depressions;
• opening the embosser, whereby the formed foil remains tacked by the indents and thus clinging to the top embosser half;
• aligning the top half including the clinging foil with the carrier surface so that the foil in each depression is aligned with the location of a respective device, and the flat foil portions between the depressions with the stripes surrounding each device;
• lowering the top half onto the carrier until the flat foil portions touch the attachment stripes and the foil bulges arch over the devices;
• and
• focusing energy-carrying radiation through the transparent top half unto the touching foil and stripes to raise the local temperature until the second and first metals are locally sealed together, forming a seal seam along the stripes surrounding each device.