Semiconductor device
AssigneeShinko Electric Industries Co., Ltd.
InventorTomoharu FUJII
Life of this patent
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Abstract
An antenna formed on one surface side of a silicon substrate and a semiconductor element provided on the other surface side of the silicon substrate are electrically connected to each other by means of a through via penetrating the silicon substrate. A wiring board is formed separately from the silicon substrate. A passive element is provided on one surface side of the wiring board. A copper core solder ball is provided between the one surface side of the wiring board and the other surface side of the silicon substrate and electrically connects the silicon substrate and the wiring board to each other.
Claims6
A semiconductor device comprising;
- a silicon substrate;
- an antenna formed on one surface side of the silicon substrate;
- a semiconductor element to be an active element which is provided on the other surface side of the silicon substrate;
- a through via penetrating the silicon substrate and electrically connecting the antenna and the semiconductor element to each other;
- a wiring board formed separately from the silicon substrate;
- a passive element provided on one surface side of the wiring board;
- and
- a connecting member provided between the one surface side of the wiring board and the other surface side of the silicon substrate and electrically connecting the silicon substrate and the wiring board to each other.
Dependencies are inferred from the claim text.