US 2009/0267209 A1Published application

Semiconductor device

AssigneeOki Semiconductor Co., Ltd.

InventorYoshinori Shizuno

Life of this patent

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Abstract

At a semiconductor device, an integrated circuit including an optoelectronic conversion device is formed on a front face of a sensor chip. A rewiring layer, which leads from pad electrodes, and post electrodes, on the rewiring layer, are formed on the sensor chip. At least a portion of surroundings of the rewiring layer and the post electrodes is sealed with sealing resin, so as to be open above the integrated circuit face. A light-transmissive substrate is disposed over the sealed sensor chip. Penetrating electrodes, corresponding with positions of the post electrodes disposed on the sensor chip, are formed in the light-transmissive substrate, and external terminals such as solder balls or the like are formed so as to electrically connect with the penetrating electrodes.

Claims7

Dependent claims

A semiconductor device comprising:

a first semiconductor chip, at a first main face of which an integrated circuit is formed;
columnar electrodes that are disposed at the first main face side of the first semiconductor chip and that are electrically connected with the integrated circuit;
a light-transmissive substrate disposed at the first main face side of the first semiconductor chip, with a predetermined gap therebetween;
substrate penetrating electrodes that are disposed to penetrate through the light-transmissive substrate between a face opposing the first semiconductor chip and a face not opposing the first semiconductor chip and that are electrically connected with the columnar electrodes;
sealing resin that seals at least a portion of the gap between the first semiconductor chip and the light-transmissive substrate;
and
external terminals that are provided at the side of the light-transmissive substrate of the face not opposing the first semiconductor chip and that are electrically connected with the penetrating electrodes.

4 more elements

Dependencies are inferred from the claim text.

Facts

Application: 12/382,338Filed 13 Mar 2009
Priority: JP 2008-11564725 Apr 2008
Published: 29 Oct 2009
Term ends: Not estimatedThe source records don’t support an estimate.

Classification9 codes

H10F 39/804
Constructional details of image sensors: containers or encapsulations
H10W 72/0198
Manufacture or treatment: batch processes
H10W 72/20
Interconnections or connectors in packages: bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
H10W 72/29
Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps: bond pads specially adapted therefor

Family

US 8,659,019 B2Related patent
US 2009/0267209 A1This patent

From the US filing history. Foreign family members aren’t listed.

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