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US 2009/0267207 A1Published application
Semiconductor device and manufacturing method thereof
AssigneeSpansion LLC
InventorsYuki Koide, Kouichi Meguro
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Abstract
A semiconductor package having a molding unit that seals bonding wires connected to electrode pads of a semiconductor chip is provided with through electrode units comprising bonding wires embedded therein and penetrating the molding unit. A leading end of the respective through electrode units is exposed from an upper surface of the molding unit and a lower surface of the molding unit.
Claims20
A semiconductor package comprising:
- a molding unit that seals a bonding wire connected to an electrode pad of a semiconductor chip,
- a through electrode unit;
- and
- a bonding wire embedded in the through electrode unit,
- wherein the through electrode unit penetrates the molding unit, and
- wherein the leading ends of the electrode pad are exposed from an upper surface of the molding unit and a lower surface of the molding unit.
3 more elements
A manufacturing method of a semiconductor package comprising:
- sealing a bonding wire connected to an electrode pad of a semiconductor chip, and
- forming a through electrode unit that embeds therein the bonding wire, wherein
- the through electrode unit penetrates the molding unit, and
- wherein the leading ends of the electrode pad are exposed from an upper surface of the molding unit and a lower surface of the molding unit.
1 more element
A semiconductor device comprising:
- a semiconductor package having a molding unit that seals a bonding wire connected to an electrode pad of a semiconductor chip;
- and
- a through electrode unit that embeds therein the bonding wire and penetrates the molding unit,
- wherein the leading ends of the electrode pad are exposed from an upper surface of the molding unit and a lower surface of the molding unit.
1 more element
Dependencies are inferred from the claim text.