Zero-reflow TSOP stacking

A stacked IC module that does not require solder reflow operations during assembly comprising:

• (a) first and second IC packages, each of the first and second IC packages comprising:
• (1) top, bottom, and peripheral sides;
• and (2) external leads that extend from one or more of the peripheral sides;
• (b) a flexible printed circuit interposer having a first side and a second side disposed between said first and second packages;
• (c) said flexible printed circuit interposer including discrete surface mount features disposed on said first and second sides comprising:
• (1) a region for attaching a lead from said first or second package;
• (2) a region for a placement of a solder ball;
• and a segment connecting the first and second regions for the solder to flow to the lead segment from the reservoir segment when heated to the reflow temperature of the solder;
• and interconnect network connecting selected surface mount features;
• (d) said contacts disposed along an edge of said flexible printed circuit interposer that corresponds with said edge bearing peripheral edge;
• (e) said flexible printed circuit interposer to be of sufficient length and width such that said contact bearing edges extend beyond the package so said contacts align with the leads of said package;
• (f) an adhesive on said first side and said second side of said interposer;
• (g) solder balls attached to the reservoir region of the surface mount feature;
• and
• (h) a solder flux compound applied to said solder balls and said contact region of surface mount feature.