Semiconductor package
AssigneeHon Hai Precision Industry Co., Ltd.
InventorCHING-YAO FU
Life of this patent
Estimating the term…
Abstract
A semiconductor package includes a semiconductor chip, a number of pads, a number of lead bars and an encapsulation material. The semiconductor chip has an upper surface and an opposite bottom surface. Area of the upper surface exceeds that of the bottom surface. The pads are mounted on the upper surface of the semiconductor chip. The lead bars are located around the semiconductor chip and electrically connected with corresponding pads. The encapsulation material covers the semiconductor chip, the pads, the lead bars and the bonding wires.
Claims19
A semiconductor package comprising:
- a semiconductor chip comprising an upper and opposite bottom surface, area of the upper surface exceeding that of the bottom surface;
- a plurality of pads mounted on the upper surface of the semiconductor;
- a plurality of lead bars corresponding to the pads located around the semiconductor chip and electrically connected to the pads;
- and
- an encapsulation material covering the semiconductor chip, the pads, and the lead bars.
A packaging method of a semiconductor package, including:
- providing a plurality of semiconductor chips, each semiconductor chip comprising an upper surface, an opposite bottom surface and four side surfaces, and a plurality of pads mounted on the upper surface of the semiconductor chip;
- forming the upper surface with an area exceeding that of the bottom surface of the semiconductor chip;
- providing a plurality of lead frames comprising a plurality of lead bars mounted on an adhesive strip, wherein the lead bars are arranged to form a plurality of receiving portions;
- placing the semiconductor chips in receiving portions, respectively, the semiconductor chip adhering on the adhesive strip via the bottom surface thereof;
- electrically connecting the pads and the corresponding lead bars;
- heating an encapsulation material to melt and coat the lead frames, the semiconductor chips and the lead bars mounted on the surface of the adhesive strip;
- removing the adhesive strip from the semiconductor chips and the lead frames;
- and dividing the encapsulated lead frame to form a plurality of single semiconductor packages when the melted encapsulation material has cured.
Dependencies are inferred from the claim text.