Method of manufacturing an image sensing micromodule

A micromodule, comprising:

• a chip comprising a semi-conductive material and having:
• an integrated circuit formed on an active face of the chip;
• a via passing through the chip and electrically linked to the integrated circuit;
• and
• a conductive lateral layer made of an electrically conductive material formed on at least one part of a lateral face of the chip and electrically linked to a conductive element of a rear face of the chip;
• a box comprising an electrically conductive element and a cavity into which the chip is inserted, the active face being disposed towards the bottom of the cavity;
• and
• an electrically conductive material deposited in the cavity and configured to electrically couple the conductive lateral layer and the conductive element.

A system comprising:

• a chip comprising a semi-conductive material and having:
• an integrated circuit formed on an active face of the chip;
• a via passing through the chip and electrically linked to the integrated circuit;
• and
• means for electrically coupling a lateral face of the chip to a rear face of the chip;
• and
• means for receiving the chip, including:
• means for providing electrostatic discharge protection;
• and
• means for electrically coupling the means for providing electrostatic discharge to the means for electrically coupling the lateral face of the chip to the rear face of the chip.