Solid-state image pickup device

A solid-state image pickup device comprising:

• a substrate;
• a transistor formed on the substrate;
• a photoelectric conversion element including a first electrode connected to a drain or a source of the transistor, a semiconductor layer stacked on the first electrode, and a second electrode stacked on the semiconductor layer;
• an upper insulating film disposed on the second electrode;
• and
• a bias line formed on the upper insulating film to be connected to the second electrode,
• wherein the first electrode is connected to the drain or the source on a lower side than the first electrode, and the bias line and the second electrode are connected to each other via a contact hole formed in the upper insulating film.

A solid-state image pickup device comprising:

• a substrate;
• a transistor formed on the substrate;
• a photoelectric conversion element including a first electrode connected to a drain or a source of the transistor, a semiconductor layer stacked on the first electrode, and a second electrode stacked on the semiconductor layer;
• and
• a bias line connected to the second electrode,
• wherein a lower insulating film is formed between the drain or the source and the first electrode, and
• wherein the first electrode is electrically connected to the drain or the source by overlapping with an upper surface of the drain or the source within a contact hole formed in the lower insulating film.