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US 2009/0267102 A1Published application
Light emitting diode package structure and method for fabricating the same
AssigneeIndustrial Technology Research Institute
InventorsYao-Jun Tsai, Chen-Peng Hsu, Chao-Wei Li, Hung-Lieh Hu
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Abstract
A light emitting diode (LED) package structure includes a carrier, a first protrusion, a LED chip, and an adhesion layer. The first protrusion is disposed on the carrier and has a first opening to expose the carrier. The LED chip is disposed in the first opening on the carrier, and a ratio between a width of the first opening and a width of the LED chip is 1˜1.5. The adhesion layer is disposed between the LED chip and the carrier to bond the LED chip to the carrier.
Claims63
A light emitting diode (LED) package structure, comprising:
- a carrier;
- a first protrusion disposed on the carrier and having a first opening to expose the carrier;
- a LED chip disposed in the first opening on the carrier, and a ratio between a width of the first opening and a width of the LED chip being 1 approximately;
- and
- an adhesion layer disposed between the LED chip and the carrier to bond the LED chip to the carrier.
2 more elements
A light emitting diode (LED) package structure, comprising:
- a carrier;
- a first protrusion disposed on the carrier and having a first opening to expose the carrier;
- a LED chip disposed in the first opening on the carrier, and a ratio between a width of the first opening and a width of the LED chip being larger than 1 and smaller than or equal to 1.5 such that a gap existing between a sidewall of the LED chip and an inner sidewall of the first opening;
- and
- an adhesion layer disposed between the LED chip and the carrier to bond the LED chip to the carrier.
2 more elements
A method for fabricating a light emitting diode (LED) package structure, comprising:
- providing a substrate having a first surface;
- disposing an adhesion layer and a LED chip on the first surface of the substrate, wherein the adhesion layer is bonded between the LED chip and the substrate, and the LED chip comprises a second surface away from the substrate;
- and
- forming a first thermal-conductive material layer on the first surface, wherein the first thermal-conductive material layer comprises a first opening to expose the LED chip, and an inner sidewall of the first opening is attached to a sidewall of the LED chip.
1 more element
A method for fabricating a light emitting diode (LED) package structure, comprising:
- providing a substrate having a recess;
- and
- disposing an adhesion layer and a LED chip on a bottom of the recess, wherein the adhesion layer is bonded between the substrate and the LED chip, and a ratio between a width of the recess and a width of the LED chip is larger than 1 and smaller than or equal to 1.5 such that a gap existing between a sidewall of the LED chip and an inner sidewall of the recess.
A method for fabricating a light emitting diode (LED) package structure, comprising:
- providing a temporary substrate and an adhesive layer disposed thereon wherein a material of the adhesive layer is a removable material;
- disposing a plurality of LED chips on the temporary substrate wherein the LED chips are partially embedded in the adhesive layer respectively;
- forming a film on the adhesive layer wherein the film covers the LED chips fully;
- singulating the temporary substrate and the adhesive layer into a plurality of LED chip units and each LED chip unit has a LED chip, a first film, a first adhesive layer and a first temporary substrate;
- disposing the LED chip unit on a substrate reversely wherein the first film is between the LED chip and the substrate and an adhesive layer is disposed between the first film and the substrate;
- forming a first protrusion formed by a thermal conductive material on the substrate wherein the first protrusion has a first opening to expose the LED chip and a ratio between a width of the first opening and a width of the LED chip being larger than 1 and smaller than or equal to 1.5;
- and
- removing the first adhesive layer and the first temporary substrate so as to expose the LED chip.
5 more elements
A light emitting diode (LED) package structure, comprising:
- a carrier having a recess;
- a LED chip disposed in the recess;
- a thermal conductive layer disposed on the carrier and in the recess wherein the portion of the thermal conductive layer in the recess is between the LED chip and the carrier and the thermal conductive layer has an opening and the LED chip is disposed therein and a ratio between a first width of the opening and a second width of the LED chip being larger than 1 and smaller than or equal to 1.5;
- a film disposed on a sidewall and a bottom of the LED chip;
- and
- an adhesive layer disposed between the LED chip and the carrier.
3 more elements
A light emitting diode (LED) package structure, comprising:
- a carrier;
- a pedestal disposed on the carrier and having a first recess wherein a bottom of the first recess has an opening exposing the carrier;
- a thermal conductive layer disposed in the first recess and has a second recess having an inside wall including a tilt wall, a vertical wall and a horizontal wall wherein the vertical wall connects the tilt wall to the horizontal wall;
- a LED chip disposed in the second recess and on the horizontal wall wherein a ratio between a minimum width of the second recess and a second width of the LED chip being larger than 1 and smaller than or equal to 1.5;
- a film disposed on the inside wall;
- and
- an adhesive layer disposed in the opening and between the thermal conductive layer and the carrier.
4 more elements
A method for fabricating a light emitting diode (LED) chip structure, comprising:
- providing a substrate with a plurality of recesses;
- forming a releasable film on the substrate and the releasable film covering the inside wall of the recesses;
- disposing a plurality of LED chips in the recesses respectively;
- forming a film on the LED chips and the releasable film wherein the film is single or multi-layered and is an adhesive layer, a mirror layer, a barrier layer or a seed layer;
- and
- removing the substrate and the releasable film.
3 more elements
Dependencies are inferred from the claim text.