Electrospray Evaporative Cooling (ESC)
AssigneeUniversity of Washington
InventorsNels E. Jewell-Larsen, Chih-Peng Hsu, Alexander V. Mamishev, Igor A. Krichtafovitch, Hsiu-Che Wang
Life of this patent
Estimating the term…
Loading patent…
AssigneeUniversity of Washington
InventorsNels E. Jewell-Larsen, Chih-Peng Hsu, Alexander V. Mamishev, Igor A. Krichtafovitch, Hsiu-Che Wang
Estimating the term…
Electrospray evaporative cooling (ESC). Means for effectuating thermal management using electrospray cooling are presented herein. An ESC may be implemented having one or more nozzles situated to spray droplets of a fluid towards a target. Because the fluid may be electrolytic, an electric field may be established between the one or more nozzles and the target can be operative to govern the direction, rate, etc. of the electrospraying between the one or more nozzles and the target. An additional shielding/field enhancement electrode may also be implemented between the one or more nozzles and the target. A droplet movement mechanism may be employed to transport droplets received at a first location of the target so that evaporation thereof may occur relatively more at a second location of the target. An ESC device may be implemented to effectuate thermal management of any of a variety of types of electronic devices.
An apparatus, comprising:
An apparatus, comprising:
An apparatus, comprising:
Dependencies are inferred from the claim text.