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US 2009/0266482 A1Published application
High-strength polyurethane adhesive
OwnerHelga Garmann, Claus-Heinrich Puck +1inventors
InventorsHelga Garmann, Claus-Heinrich Puck, Gerhard Mosshammer
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Abstract
The invention relates to a method for adhesively bonding substrates together that contains irregularities on the surface of the substrates. The adhesive is particularly suitable for adhesively bonding thin flexible substrates onto a rigid substrates.
Claims19
A process for bonding flat substrates with a moisture-crosslinkable one component polyurethane-based adhesive comprising:
- a) applying the adhesive onto a first substrate at temperature below 50° C.;
- b) optionally, storing the coated substrate;
- c) bringing a second substrate in contact with the adhesive coated on the first substrate;
- d) curing the adhesive at temperature of 50° C. and 250° C.;
- wherein the adhesive foams during curing.
2 more elements
A liquid, moisture-curable one component polyurethane adhesive comprising:
- a) a reaction product of 20 to 50 parts by weight of an oleochemical polyol,
- b) 0 to 15 parts by weight of a polyether polyol or polyester polyol with an Mn between 300 and 15000;
- and
- c) 80 to 40 parts by weight of a polyisocyanate;
- wherein the adhesive can be stored in thin layers at room temperature for 1 to 24 hours and subsequently crosslink at a temperature of 70 to 200° C.
2 more elements
The adhesive according to 14, wherein the open time of the adhesive is greater than 3 hours at a temperature below 50° C.
Dependencies are inferred from the claim text.