Polishing pad and method of use
OwnerRajeev Bajajinventor
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Abstract
Polishing pads of varying compositions for use in chemical mechanical planarization (CMP) and methods of manufacturing and using such pads. Examples of such polishing pads include two phases, one of which may be a high modulus, low wear material that maintains a stable texture when subject to a conditioning process (e.g., polyoxymethylene, Delrin, polyamide-imide (Torlon), polyetheretherketone (PEEK), and/or polysulfone), and the other of which may be a material having a polishing ability (e.g., a polyurethane material).
Claims14
A polishing pad for use in chemical mechanical planarization (CMP) comprising:
- a first phase, wherein the first phase comprises a high modulus, low wear material that maintains a stable texture when subject to a conditioning process;
- and
- a second phase, wherein the second phase comprises a material having a polishing ability.
A chemical mechanical planarization (CMP) polishing pad comprising:
- a bulk phase and a dispersed phase, wherein:
- the polishing pad includes polyurethane material of 5%-95% by weight and polyoxymethylene material;
- the polyurethane material has a hardness greater than Shore D 25;
- a modulus greater than 1000 pounds per square inch (psi);
- and a glass transition temperature below 20° C.;
- and
- the dispersed phase has a size of 200 microns or less.
A chemical mechanical planarization (CMP) polishing pad comprising:
- a bulk phase and a dispersed phase having a size of the 200 microns or less, and is made of a combination of polyurethane and polyoxymethylene, wherein the combination has the following properties:
- a tensile strength greater than 1000 psi;
- a flexural modulus greater than 2000 psi;
- and
- a Shore D hardness greater than 25.
A chemical mechanical planarization (CMP) polishing pad comprising one or more polishing elements, the polishing elements made from a polyurethane-polyoxymethylene polymer blend having following properties:
- a microporosity of 1%-20% by volume;
- a plurality of micropores having a size of 20-100 microns;
- a tensile strength greater than 1000 psi;
- a flexural modulus greater than 2000 psi;
- and
- a Shore D hardness greater than 25.
A method of manufacturing a polishing pad for use in chemical mechanical planarization (CMP), comprising:
- using at least one of an injection molding process, an extrusion process, a reaction injection molding process and a sintering process to perform the following operations:
- disperse polyoxymethylene particles in a urethane precursor mix prior to a urethane forming reaction;
- melt-mix the polyoxymethylene particles and a thermoplastic polyurethane material;
- and
- inject the melt-mixed polyoxymethylene particles and the thermoplastic polyurethane material into a mold to form the polishing pad.
Dependencies are inferred from the claim text.